Board level products for harsh environments

Thermal Clamps

Designed to ensure heat dissipation and boards’guiding


SIHD-GT / LTC thermal clamps are designed to ensure the thermal coupling between the heat sink of the printed circuit board and the cold wall of the box or of the backplane. They ensure the guiding of the boards in its locations and the locking of the daughter boards into the right position relative to the mother board by a 1/4 turn. Easy to use, safe in vibration, low weight and space saves are benefits of the design.

Maximum reliability

  • Quick locking and unlocking: SIHD-GT thermal clamps are based on a quick, quarter-turn locking mechanism providing a faster assembly
  • Maximum resistance to shocks and vibrations
  • No moving parts: all the components of the thermal clamp stay together even in the unlocked position
  • Visual indication for opening or closing position
    • Maximum thermal transfer

      • Uniform heat transfer: the SIHD-GT design allows a uniform pressure distribution all along the PCB edge, avoiding the damage of the heat sink and providing a better thermal conduction

Heat sink thickness capability

  • 0.8mm to 1.6mm ± 0.15mm [.0315 to .063 ± .0059]

Distance between daughter boards

  • 8mm MIN [.315] to 10.16mmMIN [.640]

With SIHD-GT thermal clamps range, you choose:

  • the type of the thermal clamp: left or right
  • the plating
  • the length
  • the locking devices (standard and custom tools)
  • 500 locking / unlocking cycles


Commercial avionics and airframe
Military avionics and airframe
Ground vehicle


Display unit
On board computer