Board level products for harsh environments

Flexible and rigid-flex capabilities

Flexible and rigid-flex capabilities

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Amphenol Printed Circuits’(APC) capabilities are among the world’s broadest and most advanced, delivering consistent quality and reliability for demanding high-bandwidth systems and mission critical applications for more than 25 years. Proven engineering and manufacturing expertise eliminates printed circuit board design obstacles.

Type 1 single-sided flex

A flex circuit based on one conductive layer of copper

  • Silver shielding can be added for EMI protection
  • Stiffeners can be added to « ruggedize » connection areas

Type 2 double-sided flex

A flex circuit based on two conductive layers of copper thazt are interconnected through Plated-Through-Holes (PTH’s) or Via’s creating electrically active circuitry on both conductive layers

  • Silver shielding can be added to « ruggedize connection areas
  • « Button Plating » or Pads only plating is a method when copper plating a circuit that must maximize it’s flexibility in it’s end applicaiton
  • The ability to plate to a ground plane with one conductor layer is a good cost effective way for stripline impedance

Type 3 multi-layer flex

A circuit consisting of more than two copper conductor layers (typically less than 10) that are interconnected through Plated-Through-Holes (PTH’s) or Via’s creating electrically active on all conductor layers

  • Internal Copper ground planes are a great way to achieve electrical isolation
  • Stiffeners can be added to « ruggedize » connection areas
  • « Button Plating » or Pads only plating is a method when copper plating a circuit that must maximise it’s flexibility
  • Type 4 rigid flex

    A circuit consisting of more than rwo copper conductor layers that are interconnected through Plated-Through-Holes (PTH’s) or Via’s creating electrically active circuitry on all conductor layers. The flexible layers are integral to the « rigidized » layers and both the PTH’s or Via’s are plated through thez rigid and flex areas.

    • Internal Copper ground planes are a great way to achieve electrical isolation
    • Stiffeners can be added to « ruggedize » connection areas.
    • Blind and or Buried -via’s are options to create more density therefore allowing more functionality to be designed into the Rigid-Flex

    Type 4 rigid flex book-binder

    A circuit consisting of more than two copper conductor layers that are interconnected through Plated-Through-Holes (PTH’s) or Via’s creating electrically active circuitry on all conductor layers. The flexible layers are integral to the “rigidized” layers and both the PTH’s or Via’s are plated through the rigid and flex areas; the flex-layers are built with a controlled progression to enhance flexibility.

    • Internal Copper ground planes are a great way to achieve electrical isolation
    • Stiffeners can be added to “ruggedize” connection areas
    • Blind and or Buried-via’s are options to create more density therefore allowing more functionality to be designed into the Rigid-Flex