Board level products for harsh environments




Amphenol’s InfinX high-density parallel board connector is the solution to meet increasing bandwidth demands in mezzanine applications.

Key features

Performance – 25+ Gbps: best in class electrical performance

  • Flexibility – Generous mating tolerance allows for multiple connectros per board
  • Robustness – Wafer construction « no free standing pins » eliminates pin stubbing
  • Solder Joint Reliability – BGA attachment with « blade in ball » assures reliable solder joint with high SMT processing yields
  • High Density – 17 to 26 differential pairs per linear centimer
  • Ease of Use – Designed for standard SMT processes

Superior Electrical Performance

Amphenol’s InfinXTM mezzanine connector system is your best choice for today’s high speed 10+ Gbps systems as well as tomorrow’s 25+ Gbps platforms. It’s adaptation of Amphenol’s patented « 3D Resonance Dampeniing Technology » developed for our XCede product family provides the highest level of signal ifdelity to mezzanine connectors in the industry.

  • Supports 25+ Gbps data rates
  • Stacking heights 10mm-42mm
  • 4 and 6 pair configurations
  • 17 to 26 pairs per linear centimeter
  • 85 and 100Ω versions
  • Resonance dampening technology
  • Optimized for differential performance