Board level products for harsh environments

NexLev

High-density parallel board connector

nexlev_generique

Amphenol’s NeXLev high-density parallel board connector is the solution to meet increasing bandwidth demands in mezzanine applications.

Key features

  • 57 usable signals per linear centimeter (145 signals per inch)
  • Capable of data rates up to 12.5 Gbps
  • Robust, damage-resistant design
  • Ball grid attachment using standard SMT process
  • Range of stacking heights 10-33mm

NeXLev® means more flexibility and a better way to think about PCB design. Amphenol’s NeXLev® parallel board connector makes it easy to achieve these goals, with:

  • Flexibility — Partition your system in different ways, optimize performance and manufacturability.
  • Performance — Data rates of up to 12.5 Gbps.
  • High-density — Up to 57 real signals per linear centimetre (145 signals per linear inch).
  • Reliability — Rugged wafer construction and a compliant BGA-style attachment.

NeXLev configuration

The NeXLev® connector has been designed to be user-friendly. The connector is a fully SMT connector utilizing ball grid technology for termination to the board. Designed with solder joint reliability in mind, the connector has a compliant structure and is readily applied using standard SMT processes. Standard versions of the NeXLev® connector contain either 10, 20 or 30 wafers, with each wafer containing 10 real signal contacts. This yields a usable density of 100, 200 or 300 contacts per connector.
NeXLev is available in mated heights from 10-30mm; offered in 100,200, and 300 position modules